MEMS technology is used in HFF crystal unit/HFF oscillator, so that high-frequency products can directly oscillate with the fundamental wave.

    Unlike traditional machining that thins the wafer as a whole, photolithography only reduces the thickness near the driving electrode (reverse stage structure) to maintain the strength of the chip. In this way, the high-frequency crystal oscillator of 100 MHz can directly start with the fundamental wave instead of using mature products of medium and low frequency as the reference frequency source. The lithographically processed HFF oscillator has excellent shock resistance and low phase noise, and is suitable for optical transmission installations, base stations and other communication infrastructure settings.

    Domestic enterprises have broken the lithography technology and promoted the development of products towards miniaturization and high precision.

    The hardness and physical and chemical properties of quartz crystal are stable, and the frequency does not change with temperature at all, and the internal oscillation loss caused by this is also minimal, which is very suitable for fine manufacturing. At the same time, different from traditional mechanical processing and consumption methods, the improved process is more convenient for mass consumption, and can keep the tendency to a minimum while ensuring miniaturization, so that the product has miniaturization, low power consumption, high stability, and high The advantage of frequency.

The difference between miniaturized products using QMEMS technology and the crystal front-end process of traditional machining and consumption is:

      1) The cutting process of miniaturized products is not cut into a single tuning fork crystal unit at a time, but first cut into a generous piece that can converge thousands of chip units;

      2) The tuning fork wafer and electrode forming link adopts double-sided lithography process, and the integrated processing of lithography, metal evaporation, laser frequency modulation, etc. is stopped on the WAFER wafer, and the size of a single tuning fork unit is extremely small.